24-36-60PCS High Power IR Array infrared led Chip

High Power IR Array infrared led Chips Brand Name: KATCH Color: White Input Voltage: 12V Life: 50,000h

 24-36-60PCS High Power IR Array infrared led Chips

Application:1. Indoor and outdoor commercial lighting2. Architectural Lighting3. General lighting 4. Automotive lights5. Mood Lighting, LED module6. Craft flashlights, headlights white high power led   1. Very long operating life (up to 50,000h) 2. Available different colors, such as white,blue , amber, red, green3. Superior to ESD protection 4.Viewing angle: 160 degree5.White, warm white, cool white color available, other colors likered, blue, green, yellow are available also.6.RoHS compliant7.power  :1-1000W 8.MOQ:5 piece 9.dilivery time:7 days 10.payment:L/C T/T11,Our factory can provide customized strokes according to client requirement. 11,RoSH&CE compliance.12,Good light decay<3%/1000H

 Specifications

	GLK-24	GLK-36	GLK-60
CHIP SIZE	16mil	16mil	16mil
ELECTRO CHARACTERISTICS	DC9V/450mA	DC9V/600mA	DC9V/1000mA
SIZE	Φ20mm	Φ20mm	Φ20mm
ELECTRO POWER	4W	5.4W	9W
OPTICAL POWER	1000mW	1350mW	2250mW
ELECTRO-OPTICAL CONVERSION RATE	25%	25%	25%
WAVELENGTH	850nm	850nm	850nm
OPERATING TEMPERATURE	-20°C to +60°C	-20°C to +60°C	-20°C to +60°C
MAX JUNCTION TEMPERATURE	65°C	65°C	65°C

High POwer LED(100W)

1w 3w 5w 10w 20w 30w 50w 100w 200w 300w  high power led module 1. up to 130lm/w!!!! 2. We are Erricsson Led lights suppliers for 6 six years. 3. We supply the professional driver for it!!!!! Both current regulator and voltage regulator!

4. long life time:  50000hrs 5. For 20-100w power led, we supply the lense for it.

This product adopts chip integration technics to increase total output power so as to improve  product brightness.This product adopts high integrated technics to flip directly the wafer to the heat sinks so as to make a smaller product dimension.This product adopts LED Array technology, which leads more even optical spots than LAMP.this product applies the splendid heat conduction system to remove wafer thermal resistance quickly, and to extend the product's life.This product adopts flipping encapsultion technology, and combined with high heat conduction metal aluminum baseplate in order to lower thermal.

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